VERSAPRINT 2 ULTRA3

The ULTRA³ model uses the latest measurement technology of the 3D LIST camera. The shape of the smallest solder paste depots plays a major role for the printed volume and ultimately for the shape of the solder joint. Is the paste deposit the same height over the entire surface or does it slope towards the edges? This question is answered by the ULTRA³, which combines a stencil printer and 3D SPI at the same time.